مؤتمر
Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF)
| العنوان: | Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF) |
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| المؤلفون: | Pun, Kelvin P. L., Rotanson, Jason, Dhaka, Navdeep S., Cheung, Chee-Wah, Chan, Alan H. S. |
| المصدر: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :924-931 Dec, 2018 |
| Relation: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538676684 9781538676677 |
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| DOI: | 10.1109/EPTC.2018.8654313 |