مؤتمر
Critical Factors Impacting bonding strength of UBM in Bumps and Methodologies for Optimization
| العنوان: | Critical Factors Impacting bonding strength of UBM in Bumps and Methodologies for Optimization |
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| المؤلفون: | Ramasamy, Anandan, Singh, Inderjit, Low, Shin, Lin, Bryant |
| المصدر: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :79-82 Dec, 2018 |
| Relation: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538676684 9781538676677 |
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| DOI: | 10.1109/EPTC.2018.8654383 |