مؤتمر
Solder Sphere Transfer for Wafer Level Packaging
| العنوان: | Solder Sphere Transfer for Wafer Level Packaging |
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| المؤلفون: | Glaubitz, C., Thalmann, R., Friedrichson, T., Ariffin, M.A., Bieck, F., Teutsch, T., Oppert, T. |
| المصدر: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :948-953 Dec, 2018 |
| Relation: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538676684 9781538676677 |
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| DOI: | 10.1109/EPTC.2018.8654397 |