دورية أكاديمية
A New Prewetting Process of Through Silicon Vias (TSV) Electroplating for 3D Integration
| العنوان: | A New Prewetting Process of Through Silicon Vias (TSV) Electroplating for 3D Integration |
|---|---|
| المؤلفون: | Li, C., Nie, J., Zou, J., Liu, S., Zheng, H., Fei, P. |
| المصدر: | Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 28(3):447-452 Jun, 2019 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 10577157 19410158 |
|---|---|
| DOI: | 10.1109/JMEMS.2019.2900372 |