دورية أكاديمية
Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques
| العنوان: | Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques |
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| المؤلفون: | Plovie, B., Yang, Y., Dunphy, S., Dhaenens, K., Van Put, S., Bossuyt, F., Vanfleteren, J. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(5):955-962 May, 2019 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2019.2906115 |