دورية أكاديمية
Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques
العنوان: | Stretchable Mold Interconnect Optimization: Peeling Automation and Carrierless Techniques |
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المؤلفون: | Plovie, B., Yang, Y., Dunphy, S., Dhaenens, K., Van Put, S., Bossuyt, F., Vanfleteren, J. |
المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(5):955-962 May, 2019 |
قاعدة البيانات: | IEEE Xplore Digital Library |
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