مؤتمر
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing
| العنوان: | Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing |
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| المؤلفون: | Fischbach, Robert, Horst, Tilman, Lienig, Jens |
| المصدر: | 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2019. :956-959 Mar, 2019 |
| Relation: | 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9783981926323 9783981926330 |
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| تدمد: | 15581101 |
| DOI: | 10.23919/DATE.2019.8714884 |