دورية أكاديمية
Power Module Interconnection Reliability in BTS Applications
| العنوان: | Power Module Interconnection Reliability in BTS Applications |
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| المؤلفون: | Putaala, J., Hagberg, J., Kangasvieri, T., Raumanni, J., Salmela, O., Rahko, M., Jaaskelainen, J., Galkin, T., Nousiainen, O., Jantunen, H. |
| المصدر: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(3):484-493 Sep, 2019 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 15304388 15582574 |
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| DOI: | 10.1109/TDMR.2019.2920316 |