مؤتمر
Development of Low-temperature Sintering Materials for Bare Cu lead-frame
| العنوان: | Development of Low-temperature Sintering Materials for Bare Cu lead-frame |
|---|---|
| المؤلفون: | Fukazawa, Kazuki, Mizumura, Noritsuka, Saito, Satoshi, Sasaki, Koji |
| المصدر: | 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :181-185 Apr, 2019 |
| Relation: | 2019 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784990218874 |
|---|---|
| DOI: | 10.23919/ICEP.2019.8733488 |