التفاصيل البيبلوغرافية
| العنوان: |
Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments |
| المؤلفون: |
Yu, Zechun, Wang, Shize, Letz, Sebastian, Bayer, Christoph Friedrich, Hausler, Felix, Schletz, Andreas, Suganuma, Katsuaki |
| المصدر: |
2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :229-234 Apr, 2019 |
| Relation: |
2019 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
