التفاصيل البيبلوغرافية
| العنوان: |
SiC-SiC temporary bonding compatible with rapid thermal annealing at 1000 °C |
| المؤلفون: |
Mu, Fengwen, Suga, Tadatomo, Uomoto, Miyuki, Shimatsu, Takehito, Iguchi, Kenichi, Nakazawa, Haruo |
| المصدر: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :4-4 May, 2019 |
| Relation: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
