التفاصيل البيبلوغرافية
| العنوان: |
3D Printed Interconnects on Bendable Substrates for 3D Circuits |
| المؤلفون: |
Nassar, Habib, Pullanchiyodan, Abhilash, Bhattacharjee, Mitradip, Dahiya, Ravinder |
| المصدر: |
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2019 IEEE International Conference on. :1-3 Jul, 2019 |
| Relation: |
2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
