دورية أكاديمية
Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles
| العنوان: | Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles |
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| المؤلفون: | Kwon, B., Foulkes, T., Yang, T., Miljkovic, N., King, W.P. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(2):220-229 Feb, 2020 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2019.2936852 |