مؤتمر
Ultra-Thin Package Board Level Drop Impact Modeling and Validation
| العنوان: | Ultra-Thin Package Board Level Drop Impact Modeling and Validation |
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| المؤلفون: | Yeh, Shu-Shen, Lin, P. Y., Yew, M. C., Lin, W. Y., Lee, K. C., Yang, C. C., Wang, J. H., Lai, P. C., Hsu, C. K., Jeng, Shin-Puu |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1550-1555 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728114996 9781728114989 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2019.00238 |