مؤتمر
Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
العنوان: | Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding |
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المؤلفون: | Schulze, Sebastian, Wietstruck, Matthias, Fraschke, Mirko, Kerepesi, Peter, Kurz, Helmut, Rebhan, Bernhard, Kaynak, Mehmet |
المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :218-224 May, 2019 |
Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728114996 9781728114989 |
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تدمد: | 23775726 |
DOI: | 10.1109/ECTC.2019.00040 |