مؤتمر
Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding
| العنوان: | Optimization of a BEOL Aluminum Deposition Process Enabling Wafer Level Al-Al Thermo-Compression Bonding |
|---|---|
| المؤلفون: | Schulze, Sebastian, Wietstruck, Matthias, Fraschke, Mirko, Kerepesi, Peter, Kurz, Helmut, Rebhan, Bernhard, Kaynak, Mehmet |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :218-224 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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