مؤتمر
C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process
| العنوان: | C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process |
|---|---|
| المؤلفون: | Kuo, C.H., Yang, S.B., Kuo, C.C., Chen, Y.N., Yuan, K.S., Huang, G.C., Ke, C.N., Chang, Grace, Hsu, C.C., Huang, H.L., Wang, Kirin, Ku, Harry, Chen, C.S., Liu, K.C., Kalnitsky, Alex, Liao, Marvin |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1595-1598 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728114996 9781728114989 |
|---|---|
| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2019.00245 |