مؤتمر
Improving the Solder Wettability Via Atmospheric Plasma Technology
العنوان: | Improving the Solder Wettability Via Atmospheric Plasma Technology |
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المؤلفون: | Kencana, Sagung Dewi, Kuo, Yu-Lin, Yen, Yee-Wen, Schellkes, Eckart, Chuang, Wallace |
المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2067-2071 May, 2019 |
Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728114996 9781728114989 |
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تدمد: | 23775726 |
DOI: | 10.1109/ECTC.2019.00317 |