مؤتمر
Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems
| العنوان: | Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems |
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| المؤلفون: | Cheng, Wei-Yuan, Cheng, Shau-Fei, Yang, Chen-Tsai, Chen, Wei-Han, Lai, Hsin-Cheng, Wang, Tai-Jui, Lee, Yuh-Zheng |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1877-1882 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728114996 9781728114989 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2019.00289 |