مؤتمر
Low Temperature Transient Liquid Phase (TLP) Bonding using Eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer
العنوان: | Low Temperature Transient Liquid Phase (TLP) Bonding using Eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer |
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المؤلفون: | Park, Jae-Hyeong, Park, Jongcheol, Paik, Kyung-Wook |
المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2213-2218 May, 2019 |
Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728114996 9781728114989 |
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تدمد: | 23775726 |
DOI: | 10.1109/ECTC.2019.00-15 |