مؤتمر
Low Temperature Transient Liquid Phase (TLP) Bonding using Eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer
| العنوان: | Low Temperature Transient Liquid Phase (TLP) Bonding using Eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer |
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| المؤلفون: | Park, Jae-Hyeong, Park, Jongcheol, Paik, Kyung-Wook |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2213-2218 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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