مؤتمر
PowerTherm Attach Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric Using Thermocompression Bonding
| العنوان: | PowerTherm Attach Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric Using Thermocompression Bonding |
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| المؤلفون: | Ambhore, Pranav, Mogera, Umesha, Vaisband, Boris, Shah, Ujash, Fisher, Timothy, Goorsky, Mark, Iyer, Subramanian S. |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1605-1610 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728114996 9781728114989 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2019.00247 |