مؤتمر
A Method for Dealing with Nonlinear Problems in Electronic Packaging System
| العنوان: | A Method for Dealing with Nonlinear Problems in Electronic Packaging System |
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| المؤلفون: | Zhang, Duo, Li, Er-Ping, Yang, Sichen, Lu, Qiting, Fan, Yudi |
| المصدر: | 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2019 12th International Workshop on the. :293-295 Oct, 2019 |
| Relation: | 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728142623 9781728142616 |
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| تدمد: | 25756893 |
| DOI: | 10.1109/EMCCompo.2019.8919950 |