مؤتمر
Reliability Research of TSV Micro Structure under Thermal and Vibration Coupled Load
| العنوان: | Reliability Research of TSV Micro Structure under Thermal and Vibration Coupled Load |
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| المؤلفون: | Fan, Zhengwei, Chen, Xun, Liu, Yao, Huang, Fangchao, Jiang, Yu, Zhang, Shufeng, Wang, Yashun |
| المصدر: | 2019 Prognostics and System Health Management Conference (PHM-Qingdao) Prognostics and System Health Management Conference (PHM-Qingdao), 2019. :1-7 Oct, 2019 |
| Relation: | 2019 Prognostics and System Health Management Conference (PHM-Qingdao) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728108612 9781728108605 |
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| DOI: | 10.1109/PHM-Qingdao46334.2019.8942986 |