التفاصيل البيبلوغرافية
| العنوان: |
Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment |
| المؤلفون: |
Schischke, Karsten, Manessis, Dionysios, Pawlikowski, Jakub, Kupka, Tobias, Krivec, Thomas, Pamminger, Rainer, Glaser, Sebastian, Podhradsky, Gerhard, Nissen, Nils F., Schneider-Ramelow, Martin, Lang, Klaus-Dieter |
| المصدر: |
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-8 Sep, 2019 |
| Relation: |
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
