مؤتمر
Study of heatsink grounding schemes for GHz microprocessors
| العنوان: | Study of heatsink grounding schemes for GHz microprocessors |
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| المؤلفون: | Radhakrishnan, K., Wittwer, D., Yuan-Liang Li |
| المصدر: | IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.. :189-192 2000 |
| Relation: | IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780364503 9780780364509 |
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| DOI: | 10.1109/EPEP.2000.895525 |