التفاصيل البيبلوغرافية
| العنوان: |
Temperature rise test method of hot bridgewire EED under steady conditions |
| المؤلفون: |
Lu, Xinfu, Wei, Guanghui, Sun, Yongwei, Pan, Xiaodong, Wan, Haojiang, Wang, Biao |
| المصدر: |
2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC) Electromagnetic Compatibility (ISEMC), 2019 IEEE 6th International Symposium on. :1-4 Nov, 2019 |
| Relation: |
2019 IEEE 6th International Symposium on Electromagnetic Compatibility (ISEMC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
