دورية أكاديمية
Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias
العنوان: | Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias |
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المؤلفون: | Ahmed, O., Jalilvand, G., Okoro, C., Pollard, S., Jiang, T. |
المصدر: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 20(1):199-203 Mar, 2020 |
قاعدة البيانات: | IEEE Xplore Digital Library |
تدمد: | 15304388 15582574 |
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DOI: | 10.1109/TDMR.2020.2973940 |