Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias

التفاصيل البيبلوغرافية
العنوان:	Micro-Compression of Freestanding Electroplated Copper Through-Glass Vias
المؤلفون:	Ahmed, O., Jalilvand, G., Okoro, C., Pollard, S., Jiang, T.
المصدر:	IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 20(1):199-203 Mar, 2020
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
تدمد:	15304388 15582574
DOI:	10.1109/TDMR.2020.2973940