التفاصيل البيبلوغرافية
العنوان: |
Study of the High-tech Process Mechanical Integrity and Electrical Safety |
المؤلفون: |
Chang, Kuo-Chi, Chu, Kai-Chun, Chen, Tsou-Li, Lee, Yueh-Lung Ward, Lin, Yuh-Chung, Nguyen, Trong-The |
المصدر: |
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :162-165 Oct, 2019 |
Relation: |
2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: |
IEEE Xplore Digital Library |