مؤتمر
Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package
| العنوان: | Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package |
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| المؤلفون: | Park, Ah-Young, Lee, Jae Hak, Song, Jun-Yeob, Kim, Seung Man, Han, Seongheum |
| المصدر: | 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :99-102 Dec, 2019 |
| Relation: | 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728138350 9781728138343 |
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| DOI: | 10.1109/EPTC47984.2019.9026606 |