مؤتمر
Factors Impacting Bump Solder Extrusion, Failure Mechanism and Methodologies to Improve
| العنوان: | Factors Impacting Bump Solder Extrusion, Failure Mechanism and Methodologies to Improve |
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| المؤلفون: | Ramasamy, Anandan, Singh, Inderjit, Low, Shin, Lin, Bryant |
| المصدر: | 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :53-56 Dec, 2019 |
| Relation: | 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728138350 9781728138343 |
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| DOI: | 10.1109/EPTC47984.2019.9026656 |