مؤتمر
Wafer level lead free solder bumping process and characterization
| العنوان: | Wafer level lead free solder bumping process and characterization |
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| المؤلفون: | Viswanadam, G., Leow Khim Han |
| المصدر: | International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Electronic materials and packaging Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. :7-11 2000 |
| Relation: | International Symposium on Electronic Materials and Packaging (EMAP2000) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780366549 9780780366541 |
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| DOI: | 10.1109/EMAP.2000.904127 |