مؤتمر
Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints
| العنوان: | Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints |
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| المؤلفون: | Pang, H.L.J., Bong, S.N., Shi, X.Q., Wang, Z.P. |
| المصدر: | International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Electronic materials and packaging Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. :197-200 2000 |
| Relation: | International Symposium on Electronic Materials and Packaging (EMAP2000) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780366549 9780780366541 |
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| DOI: | 10.1109/EMAP.2000.904154 |