مؤتمر
Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints
العنوان: | Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints |
---|---|
المؤلفون: | Pang, H.L.J., Bong, S.N., Shi, X.Q., Wang, Z.P. |
المصدر: | International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Electronic materials and packaging Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on. :197-200 2000 |
Relation: | International Symposium on Electronic Materials and Packaging (EMAP2000) |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!