التفاصيل البيبلوغرافية
| العنوان: |
Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs |
| المؤلفون: |
Miki, Takuji, Nagata, Makoto, Tsukioka, Akihiro, Miura, Noriyuki, Okidono, Takaaki, Araga, Yuuki, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya |
| المصدر: |
2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019 |
| Relation: |
2019 International 3D Systems Integration Conference (3DIC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
