مؤتمر
Electrical and thermal modelling of QFN packages
العنوان: | Electrical and thermal modelling of QFN packages |
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المؤلفون: | Lu, A.C.W., Xie, D.J., Shi, Z.F., Ryu, W. |
المصدر: | Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) Electronic packaging technology Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd. :352-356 2000 |
Relation: | Proceedings of 3rd Electronics Packaging Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780366441 9780780366442 |
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DOI: | 10.1109/EPTC.2000.906399 |