مؤتمر
Electrical and thermal modelling of QFN packages
| العنوان: | Electrical and thermal modelling of QFN packages |
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| المؤلفون: | Lu, A.C.W., Xie, D.J., Shi, Z.F., Ryu, W. |
| المصدر: | Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) Electronic packaging technology Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd. :352-356 2000 |
| Relation: | Proceedings of 3rd Electronics Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780366441 9780780366442 |
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| DOI: | 10.1109/EPTC.2000.906399 |