مؤتمر
Methodology for a highly accelerated solder joint reliability test
| العنوان: | Methodology for a highly accelerated solder joint reliability test |
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| المؤلفون: | Pang, H.L.J., Ang, K.H., Shi, X.Q., Wang, Z.P. |
| المصدر: | Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) Electronic packaging technology Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd. :385-390 2000 |
| Relation: | Proceedings of 3rd Electronics Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780366441 9780780366442 |
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| DOI: | 10.1109/EPTC.2000.906405 |