مؤتمر
Electro-thermal finite element analysis of IGBT module under sinusoidal current load
| العنوان: | Electro-thermal finite element analysis of IGBT module under sinusoidal current load |
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| المؤلفون: | Wu, Wei, Li, Xianbing, Wang, Liang, Lin, Zhongkang |
| المصدر: | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-6 Aug, 2019 |
| Relation: | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728150642 9781728150635 |
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| DOI: | 10.1109/ICEPT47577.2019.245348 |