مؤتمر
Effect of Ag on IMC Growth and Shear Strength of Sn-3.5Ag/Cu microbumps
| العنوان: | Effect of Ag on IMC Growth and Shear Strength of Sn-3.5Ag/Cu microbumps |
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| المؤلفون: | Guo, Fayao, Ling, Huiqin, Yin, Yihao, Li, Ming, Zhang, Wenqi, Cao, Liqiang |
| المصدر: | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019 |
| Relation: | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728150642 9781728150635 |
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| DOI: | 10.1109/ICEPT47577.2019.245191 |