مؤتمر
Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures
| العنوان: | Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures |
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| المؤلفون: | Li, Wang-Yun, Peng, Guan-Qiang, Cheng, Tian-Xiang, Qin, Hong-Bo, Huang, Jia-Qiang, Yang, Dao-Guo |
| المصدر: | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019 |
| Relation: | 2019 20th International Conference on Electronic Packaging Technology(ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728150642 9781728150635 |
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| DOI: | 10.1109/ICEPT47577.2019.245195 |