دورية أكاديمية
Study of the Effect of No-Clean Flux Residue on Signal Integrity at High Frequency
| العنوان: | Study of the Effect of No-Clean Flux Residue on Signal Integrity at High Frequency |
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| المؤلفون: | Nguyen, J., Geiger, D., Xiao, G., Shangguan, D. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(6):1054-1060 Jun, 2020 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2020.2991945 |