التفاصيل البيبلوغرافية
| العنوان: |
High Speed Silicon Wet Bulk Micromachining of Si{111} in KOH Based Solution |
| المؤلفون: |
Rao, Avvaru Venkata Narasimha, Pal, Prem, Pandey, Ashok Kumar, Menon, P Krishna, Tanaka, Hiroshi, Sato, Kazuo |
| المصدر: |
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP), 2020 Symposium on. :1-5 Jun, 2020 |
| Relation: |
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
