دورية أكاديمية
Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant
العنوان: | Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant |
---|---|
المؤلفون: | Yerasimou, Y., Pickert, V., Dai, S., Wang, Z. |
المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(11):1849-1860 Nov, 2020 |
قاعدة البيانات: | IEEE Xplore Digital Library |
تدمد: | 21563950 21563985 |
---|---|
DOI: | 10.1109/TCPMT.2020.3011043 |