Automatic Industry PCB Board DIP Process Defect Detection with Deep Ensemble Method

التفاصيل البيبلوغرافية
العنوان: Automatic Industry PCB Board DIP Process Defect Detection with Deep Ensemble Method
المؤلفون: Li, Yu-Ting, Kuo, Paul, Guo, Jiun-In
المصدر: 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE) Industrial Electronics (ISIE), 2020 IEEE 29th International Symposium on. :453-459 Jun, 2020
Relation: 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781728156354
9781728156347
تدمد:21635145
DOI:10.1109/ISIE45063.2020.9152533