التفاصيل البيبلوغرافية
| العنوان: |
Analysis of SiC Schottky diodes after thermal vacuum test by means of lock-in infrared thermography |
| المؤلفون: |
Vellvehi, M., Perpina, X., Avino, O., Ferrer, C., Fuste, N., Sanchez, D., Jorda, X., Godignon, P., Massetti, S. |
| المصدر: |
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-6 Jul, 2020 |
| Relation: |
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
