التفاصيل البيبلوغرافية
| العنوان: |
A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors |
| المؤلفون: |
Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J. |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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