مؤتمر
Effect of Dielectric Process on the Interfacial Adhesion of RDL for FOWLP
| العنوان: | Effect of Dielectric Process on the Interfacial Adhesion of RDL for FOWLP |
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| المؤلفون: | Son, Kirak, Kim, Gahui, Park, Young-Bae, Ryu, Hyun-Kyu |
| المصدر: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :348-353 Jun, 2020 |
| Relation: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728161808 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC32862.2020.00063 |