التفاصيل البيبلوغرافية
| العنوان: |
Design and Validation of Reliability Physics for Interconnect Architectures Induced from Inclusive TM/SM/EM Effects |
| المؤلفون: |
Lee, Chang-Chun, Chuang, Jui-Chang, Chiu, Steve, Cheng, Shau-Fei, Yang, Chen-Tsai, Cheng, Wei-Yuan |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1849-1554 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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