التفاصيل البيبلوغرافية
| العنوان: |
Evaluation of package-level EMI shielding using conformally coated conductive and magnetic materials in low and high frequency ranges |
| المؤلفون: |
Joo, Kisu, Lee, Kyu Jae, Jun Sung, Hyun, Lee, Seung Jae, Young Jeong, Se, Park, Hyun Ho, Kim, Yoon-Hyun |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :647-652 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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