التفاصيل البيبلوغرافية
| العنوان: |
Effect of a Backing Material on the Bendability of Flexible Substrates with Passive SMD components |
| المؤلفون: |
Sondhi, Kartik, Reddy Avuthu, Sai Guruva, Richards, Nathaniel, Fan, Z. Hugh, Nishida, Toshikazu |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1542-1547 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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